Nisene Technology Group - B&G International

World Leaders in Automated Decapsulator Technology, IC Delayering and Plastic Etching

JetEtch Decapsulation System

Staying inline with Nisene Technology Group's (formerly B&G International) rich tradition in the automated decapsulation of plastic integrated circuits, NTG engineers, manufactures, and services the most advanced and successful decapsulator on the market to date, the JetEtch.

NTG strives to remain on the cutting-edge with its decap technologies. As such, the JetEtch continues to maintain its foothold in the semiconductor failure analysis industry as the ideal method to deapping most of today's advanced plastic (and other compounds) packages.

Click the image above or here for product specifications on the JetEtch.

Laser Decapsulation Systems

Nisene also offers its customers with several different models of laser-based decapsulation systems. The move toward "greener" decapsulation technology has become more prevalent in recent years, especially in Europe and Asia; the Americas are beginning to see this requirement as well. As such, Nisene is leading the way yet again by offering its latest innovation in the decapsulation industry with the FA-LIT laser decapsulation system — thereby creating a foothold on the decapsulation equipment market with not only the best wet-decapsulation system available, but now a laser decapsulation system as well.

The Nisene laser decapsulation systems offer a wide variety of application processes. From standard laser ablation decap to cross-sectioning and everything in between, our laser systems have you covered. We even have a proprietary method in use in our GEL model that allows the decapsulation of gel encapsulants by laser — a process previously impossible with traditional laser systems.

Click here or on the image above to read more about our laser decapsulation equipment.

GelEtch Delayering System

The GelEtch delayering system is a complete cosmetic overhaul of the world-famous OmniEtch delayering system introduced a few years ago. Retaining the same operational principles as its predecessor, the GelEtch features a 40% reduced footprint, nearly 60% reduction in weight, and a much simpler — and more intuitive — user interface.

As its predessor, the GelEtch die delayering system's unique, proprietary method of wet chemical delivery to an integrated circuit (either individual die or wafer-level), the GelEtch is capable of delayering a die — one selective level at a time! The benefit that the GelEtch has over previous methods — such as lapping — are numerous; the primary being that the etching is layer-specific. Due to its uniquely engineered medium, the die's vias remain intact during the etch, with underlying layers remaining completely unaffected.

OmniEtch Delayering System (Replaced with GelEtch, above)

As the need for more sophisticated failure analysis grows, so, too, must the instrumentation with which the industry's most complex integrated circuits are analyzed. In collaboration with Texas Instruments, NTG has developed the latest in delayering technology, the OmniEtch.

With its unique, proprietary method of wet chemical delivery to an integrated circuit (either individual die or wafer-level), the OmniEtch is capable of delayering a die — one selective level at a time! The benefit that the OmniEtch has over previous methods — such as lapping — are numerous; the primary being that the etching is layer-specific. Due to its uniquely engineered medium, the die's vias remain intact during the etch, with underlying layers remaining completely unaffected.

Click the image above or here for product specifications on the OmniEtch.